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首页 > Products >Integrated Circuits (ICs) >Interface - Telecom >BU8788KN-E2 > BU8788KN-E2 Compare > BU8788KN-E2 HSC-PA-1(60) FLCSMC6GVL Compare
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(BU8788KN-E2.PDF,
BU8788KN-E2.docx,
BU8788KN-E2.zip)

BU8788KN-E2

BU8788KN-E2 

Bulk refers to a package (usually a bag) of loose unorganized parts, and is usually unsuitable for automated assembly machines. Bulk parts are packaged according to the ESD (ElectroStatic Discharge) and MSL (Moisture Sensitivity Level) protection requirements determined by the manufacturer.
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(FLCSMC6GVL.PDF,
FLCSMC6GVL.docx,
FLCSMC6GVL.zip)

FLCSMC6GVL

FLCSMC6GVL 

Bulk refers to a package (usually a bag) of loose unorganized parts, and is usually unsuitable for automated assembly machines. Bulk parts are packaged according to the ESD (ElectroStatic Discharge) and MSL (Moisture Sensitivity Level) protection requirements determined by the manufacturer.
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(HSC-PA-1(60).PDF,
HSC-PA-1(60).docx,
HSC-PA-1(60).zip)

HSC-PA-1(60)

HSC-PA-1(60) 

Image Part Number Manufacturer Datasheet Pricing(USD) Applications Products Category Remark Package Qty Series Part Status Type Intended Chipset Chipset Manufacturer Voltage - Primary Voltage - Auxiliary Voltage - Isolation Inductance @ Frequency Frequency Operating Temperature Mounting Type Size / Dimension Height - Seated (Max) Footprint Style Accessory Type For Use With/Related Products Compare
BU8788KN-E2 BU8788KN-E2

(Alternative models available)

 ROHM Semiconductor Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(BU8788KN-E2.PDF,
BU8788KN-E2.docx,
BU8788KN-E2.zip)

1+: $8

10+: $7.92

100+: $7.84

500+: $7.76

1000+: $7.68

 Appliances
Mobile phones
PC & notebooks

Products:集成电路（IC）--接口 - 电信

Manufacturers: ROHM Semiconductor.
omoelec is one of the Distributors.
Wide range of applications.

Tape & Reel (TR) 4498 In Stock - Not For New Designs - - - - - - - - -40°C ~ 85°C Surface Mount - - - - - - Compare
FLCSMC6GVL FLCSMC6GVL

(Alternative models available)

 Panduit Corporation Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(FLCSMC6GVL.PDF,
FLCSMC6GVL.docx,
FLCSMC6GVL.zip)

1+: $24

10+: $23.76

100+: $23.52

500+: $23.28

1000+: $23.04

 Medical
Data storage

Products:连接器，互连器件--光纤连接器组件

Manufacturers: Panduit Corporation.
omoelec is one of the Distributors.
Wide range of applications.

8615 In Stock * Active - - - - - - - - - - - - - - - - Compare
HSC-PA-1(60) HSC-PA-1(60)

(Alternative models available)

 Hirose Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(HSC-PA-1(60).PDF,
HSC-PA-1(60).docx,
HSC-PA-1(60).zip)

1+: $11

10+: $10.89

100+: $10.78

500+: $10.67

1000+: $10.56

 Grid infrastructure
Enterprise machine

Products:连接器，互连器件--光纤连接器组件

Manufacturers: Hirose.
omoelec is one of the Distributors.
Wide range of applications.

5026 In Stock HSC Active - - - - - - - - - - - - - - - - Compare
  • BU8788KN-E2
  • FLCSMC6GVL
  • HSC-PA-1(60)