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首页 > Products >Development Boards, Kits, Programmers >Accessories >UP-BACKPLANE-01-EK > UP-BACKPLANE-01-EK Compare > UP-BACKPLANE-01-EK 1-281839-2 65239-216LF Compare
Bulk refers to a package (usually a bag) of loose unorganized parts, and is usually unsuitable for automated assembly machines. Bulk parts are packaged according to the ESD (ElectroStatic Discharge) and MSL (Moisture Sensitivity Level) protection requirements determined by the manufacturer.
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(UP-BACKPLANE-01-EK.PDF,
UP-BACKPLANE-01-EK.docx,
UP-BACKPLANE-01-EK.zip)

UP-BACKPLANE-01-EK

UP-BACKPLANE-01-EK 

Bulk refers to a package (usually a bag) of loose unorganized parts, and is usually unsuitable for automated assembly machines. Bulk parts are packaged according to the ESD (ElectroStatic Discharge) and MSL (Moisture Sensitivity Level) protection requirements determined by the manufacturer.
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(65239-216LF.PDF,
65239-216LF.docx,
65239-216LF.zip)

65239-216LF

65239-216LF 

Bulk refers to a package (usually a bag) of loose unorganized parts, and is usually unsuitable for automated assembly machines. Bulk parts are packaged according to the ESD (ElectroStatic Discharge) and MSL (Moisture Sensitivity Level) protection requirements determined by the manufacturer.
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(1-281839-2.PDF,
1-281839-2.docx,
1-281839-2.zip)

1-281839-2

1-281839-2 

Image Part Number Manufacturer Datasheet Pricing(USD) Applications Products Category Remark Package Qty Series Part Status Type Intended Chipset Chipset Manufacturer Voltage - Primary Voltage - Auxiliary Voltage - Isolation Inductance @ Frequency Frequency Operating Temperature Mounting Type Size / Dimension Height - Seated (Max) Footprint Style Accessory Type For Use With/Related Products Compare
UP-BACKPLANE-01-EK UP-BACKPLANE-01-EK

(Alternative models available)

 Silicon Labs Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(UP-BACKPLANE-01-EK.PDF,
UP-BACKPLANE-01-EK.docx,
UP-BACKPLANE-01-EK.zip)

1+: $206

10+: $203.94

100+: $201.88

500+: $199.82

1000+: $197.76

 Hybrid, electric & powertrain systems
Electronic point of sale (EPOS)
Mobile phones

Products:开发板，套件，编程器--开发板，编程器配件

Manufacturers: Silicon Labs.
omoelec is one of the Distributors.
Wide range of applications.

7443 In Stock - Active - - - - - - - - - - - - - - Backplane Unified Development Platform (UDP) Boards Compare
65239-216LF 65239-216LF

(Alternative models available)

 Storage & Server IO (Amphenol ICC) Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(65239-216LF.PDF,
65239-216LF.docx,
65239-216LF.zip)

1+: $0

10+: $0

100+: $0

500+: $0

1000+: $0

 Portable electronics

Products:连接器，互连器件--矩形连接器 - 外壳

Manufacturers: Storage & Server IO (Amphenol ICC).
omoelec is one of the Distributors.
Wide range of applications.

2661 In Stock * Active - - - - - - - - - - - - - - - - Compare
1-281839-2 1-281839-2

(Alternative models available)

 TE Connectivity AMP Connectors Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(1-281839-2.PDF,
1-281839-2.docx,
1-281839-2.zip)

1+: $0

10+: $0

100+: $0

500+: $0

1000+: $0

 Medical
Wearables (non-medical)

Products:连接器，互连器件--矩形连接器 - 外壳

Manufacturers: TE Connectivity AMP Connectors.
omoelec is one of the Distributors.
Wide range of applications.

8860 In Stock HE13/HE14 Active - - - - - - - - - Free Hanging (In-Line) - - - - - - Compare
  • UP-BACKPLANE-01-EK
  • 65239-216LF
  • 1-281839-2