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首页 > Products >Development Boards, Kits, Programmers >Evaluation Boards - Expansion Boards, Daughter Car >FSP200 DEVELOPMENT KIT > FSP200 DEVELOPMENT KIT Compare > FSP200 DEVELOPMENT KIT 1-281839-2 65239-216LF Compare
Bulk refers to a package (usually a bag) of loose unorganized parts, and is usually unsuitable for automated assembly machines. Bulk parts are packaged according to the ESD (ElectroStatic Discharge) and MSL (Moisture Sensitivity Level) protection requirements determined by the manufacturer.
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(FSP200 DEVELOPMENT KIT.PDF,
FSP200 DEVELOPMENT KIT.docx,
FSP200 DEVELOPMENT KIT.zip)

FSP200 DEVELOPMENT KIT

FSP200 DEVELOPMENT KIT 

Bulk refers to a package (usually a bag) of loose unorganized parts, and is usually unsuitable for automated assembly machines. Bulk parts are packaged according to the ESD (ElectroStatic Discharge) and MSL (Moisture Sensitivity Level) protection requirements determined by the manufacturer.
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(65239-216LF.PDF,
65239-216LF.docx,
65239-216LF.zip)

65239-216LF

65239-216LF 

Bulk refers to a package (usually a bag) of loose unorganized parts, and is usually unsuitable for automated assembly machines. Bulk parts are packaged according to the ESD (ElectroStatic Discharge) and MSL (Moisture Sensitivity Level) protection requirements determined by the manufacturer.
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(1-281839-2.PDF,
1-281839-2.docx,
1-281839-2.zip)

1-281839-2

1-281839-2 

Image Part Number Manufacturer Datasheet Pricing(USD) Applications Products Category Remark Package Qty Series Part Status Type Intended Chipset Chipset Manufacturer Voltage - Primary Voltage - Auxiliary Voltage - Isolation Inductance @ Frequency Frequency Operating Temperature Mounting Type Size / Dimension Height - Seated (Max) Footprint Style Accessory Type For Use With/Related Products Compare
FSP200 DEVELOPMENT KIT FSP200 DEVELOPMENT KIT

(Alternative models available)

 IR (Infineon Technologies) Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(FSP200 DEVELOPMENT KIT.PDF,
FSP200 DEVELOPMENT KIT.docx,
FSP200 DEVELOPMENT KIT.zip)

1+: $232

10+: $229.68

100+: $227.36

500+: $225.04

1000+: $222.72

 Building automation
Enterprise projectors

Products:开发板，套件，编程器--评估板 - 扩展板，子板

Manufacturers: IR (Infineon Technologies).
omoelec is one of the Distributors.
Wide range of applications.

3863 In Stock - Active Sensor - - - - - - - - - - - - - - - Compare
65239-216LF 65239-216LF

(Alternative models available)

 Storage & Server IO (Amphenol ICC) Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(65239-216LF.PDF,
65239-216LF.docx,
65239-216LF.zip)

1+: $0

10+: $0

100+: $0

500+: $0

1000+: $0

 Portable electronics

Products:连接器，互连器件--矩形连接器 - 外壳

Manufacturers: Storage & Server IO (Amphenol ICC).
omoelec is one of the Distributors.
Wide range of applications.

2661 In Stock * Active - - - - - - - - - - - - - - - - Compare
1-281839-2 1-281839-2

(Alternative models available)

 TE Connectivity AMP Connectors Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(1-281839-2.PDF,
1-281839-2.docx,
1-281839-2.zip)

1+: $0

10+: $0

100+: $0

500+: $0

1000+: $0

 Medical
Wearables (non-medical)

Products:连接器，互连器件--矩形连接器 - 外壳

Manufacturers: TE Connectivity AMP Connectors.
omoelec is one of the Distributors.
Wide range of applications.

8860 In Stock HE13/HE14 Active - - - - - - - - - Free Hanging (In-Line) - - - - - - Compare
  • FSP200 DEVELOPMENT KIT
  • 65239-216LF
  • 1-281839-2