Vishay Intertechnology Launched 10 New TbS Rectifiers In MicroSMP Packages

Author:OMO Release Date: Jul 21, 2017

Vishay Intertechnology, Inc. announced the addition of 10 new TbS Trench MOS barrier Schottky rectifiers with eSMP series MicroSMP (DO-219AD) packages for 1A and 2A devices. Vishay General Semiconductor's new rectifier saves space and replaces the Schottky rectifier in the SOD123W package with a reverse voltage from 45V to 150V, with the industry's first 2A TMBS rectifier in a MicroSMP package down to 0.40V.

At present, 2A current Schottky rectifier is generally used SOD123W and SMA package. Today's release of these devices in the smaller MicroSMP package can also output high forward current, thereby increasing the power density. Rectifier size of 2.5mm x 1.3mm, height 0.65mm, 35% thinner than SOD123W, while accounting for 45% less board space. To achieve good thermal performance, MicroSMP package uses an asymmetric lead frame design.If you want to learn more information, you can go to

1A rectifier forward voltage drop of 0.36V, 2A device forward voltage drop of 0.40V, enough to reduce power consumption and improve efficiency. For low voltage high frequency inverter, DC / DC converter, freewheeling and polarity protection and other industrial and commercial applications. These devices are also certified by AEC-Q101, which can be used in automotive applications.

The maximum working temperature of the new rectifier is + 175 ° C and the moisture sensitivity level reaches 1 level of per J-STD-020. The highest peak value of LF is + 260 ℃. The device is very suitable for automatic placement, RoHS compliant, halogen free.

Reference: how to test pmdxb950upe and how to test nrf51822